Shahig uses necessary cookies to operate this website and optional Google Analytics cookies to understand website usage and improve performance. Analytics cookies will only be activated with your consent. You can accept, decline or change your preferences at any time.

Awaiting product image

Shahig ASC25R1 Bonded Semiconductor Tool with Chamfer

ASC25R1 is used for bonded semiconductor removal with chamfering, supporting controlled preparation where short remaining cable lengths must be handled steadily.

SKU: SHG-IND-ASC25R1 Category: Tags: , , , ,

Overview

ASC25R1 is a dedicated bonded semiconductor preparation tool with chamfer capability. According to the brochure, it incorporates a holding plate for steadiness on cables with short remaining lengths, quick handle setup, and preset blade positioning for controlled thickness removal.

Features

Holding plate for steadiness; quick handle setup; preset blade position (0.7 mm / 0.03 in on ASC25F).

Specifications

Manual semiconductor preparation tool; chamfer-capable.

Detailed Technical Data

Designed for bonded semiconductor work with controlled blade position; suitable for precision preparation before accessories.

Compliances and Approvals

Use according to cable accessory preparation instructions.

Applications

MV cable semiconductor preparation and chamfering before termination or joint installation.

Product Type

Bonded semiconductor preparation tool
Brand

SFE International / Penta ESP
Made in

As per OEM / EU
Weight

Not specified in brochure
Size

Portable manual tool
Material

Metal body with guide rods and handle
Specification Summary

Bonded semiconductor tool with chamfer support, steadying plate, quick handle setup and preset blade position for controlled cuts.
Type

Bonded semiconductor preparation tool

Reviews

There are no reviews yet.

Be the first to review “Shahig ASC25R1 Bonded Semiconductor Tool with Chamfer”

Your email address will not be published. Required fields are marked *

Related products

Scroll to Top