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Shahig CWB/18-60-FEP Bonded Semiconductor Removal Tool

CWB/18-60-FEP is used to remove bonded semiconductor layers while creating a clean chamfer on the insulation. It is designed for clean, fast cable preparation work.

SKU: SHG-IND-CWB1860FEP Category: Tags: , , , ,

Overview

CWB/18-60-FEP is a cable preparation tool used to remove bonded semiconductor screens while simultaneously creating a chamfer. The brochure emphasizes removal without lubricant and a very smooth finish on the insulation, making it suitable for MV cable accessory preparation workflows.

Features

Removes bonded semiconductor; creates chamfer; no lubricant required; smooth insulation finish.

Specifications

Manual bonded semiconductor removal tool; chamfering function included.

Detailed Technical Data

For cable preparation on bonded semiconductor layers; exact cable diameter range is model-coded (18-60).

Compliances and Approvals

Use according to manufacturer instructions and cable accessory preparation procedures.

Applications

MV cable preparation before joints and terminations.

Product Type

Semiconductor removal / chamfer tool
Brand

SFE International / Penta ESP
Made in

As per OEM / EU
Weight

Not specified in brochure
Size

Portable manual tool
Material

Metal body with guide rollers and cutting assembly
Specification Summary

Cable preparation tool for bonded semiconductor removal with integrated chamfering, smooth insulation finish and no lubricant requirement.
Type

Semiconductor removal / chamfer tool

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